300JPF4GF: Super 3mm Red LED Lamp (60 Degree)

Solder Dipping	Soldering
(1) Pre-Heat: 100^0C Max.	(1) 30W Max. Soldering Iron
(2) Pre-Heat Time: 60 seconds	(2) Soldering Temperature: 300^0C Max.
(3) Solder Temperature: 260^0C Max	(3) Soldering Time: 3 seconds Max.
(4) Dipping Time: 5 Sec. Max. & No closer than 3mm from bulb	(4) No closer than 3mm from base of bulb

Absolute Maximum Rating (Ta = 25⁰C)

PARAMETER	MAXIMUM RATING	UNITS
DC Forward Current	20	mA
Reverse Voltage (IR = 10mA)	5	V
Peak Pulse Forward Current (1)	100	mA
Avg. Forward Current (Pulse Operation)	30	mA
Operating Temperature	-30 to +80	^0C
Storage Temperature	-40 to +100	^0C

(1) Pulse conditions of 1/10 duty and 10msec width

Electro-optical Characteristics (Ta = 25⁰C)

PARAMETER	SYMBOL	CONDITIONS	MIN.	TYP.	MAX.	UNIT
Forward Voltage	VF	IF = 20mA	1.8		2.4	V
Reverse Voltage	VR	IR = 10mA			5	V
Dominant Wavelength	lD	IF = 20mA		630		nm
Viewing Angle	2q1/2	IF = 20mA		60		Deg.
Luminous Intensity	IV	IF = 20mA		3,000		mcd

INTENSITY BIN l_v (mcd)

Bin Code	Min.	Max.	Vf (V)
1	2,000	2,500	1 = 1.7V-1.9V
2	2,500	3,300	2 = 1.9V-2.1V
3	3,300	3,800	3 = 2.1V-2.3V
4	3,800	4,500	4 = 2.2V-2.5V

COLOR BIN C_B (x,y)

W1	620 nm – 625nm
W2	625 nm – 630 nm
W3	630 nm – 635 nm

DEVICE DRAWING

LC LED Corporation